한국생산제조학회 학술지 영문 홈페이지
[ Technical Papers ]
Journal of the Korean Society of Manufacturing Technology Engineers - Vol. 28, No. 4, pp.260-265
ISSN: 2508-5107 (Online)
Print publication date 15 Aug 2019
Received 10 Jul 2019 Revised 08 Aug 2019 Accepted 14 Aug 2019
DOI: https://doi.org/10.7735/ksmte.2019.28.4.260

마스크 기반 전해증착을 통한 미세 전극 형상 제작

박민수a, b, * ; 김재경b
Fabrication of Micro Electrode Using Electrochemical Deposition based on Mask
MinSoo Parka, b, * ; JaeKyung Kimb
aGraduate School of Nano IT Design Fusion, Seoul National University of Science and Technology, 232, Gongneung-ro, Nowon-gu, Seoul 01811, Korea
bDepartment of Mechanical System Design Engineering, Seoul National University of Science and Technology, 232, Gongneung-ro, Nowon-gu, Seoul 01811, Korea

Correspondence to: *Tel.: +82-2-970-6356 Fax: +82-2-976-5173 E-mail address: pminsoo@seoultech.ac.kr (MinSoo Park).

Abstract

Various methods to fabricate micro electrodes exist; however, these methods are generally complex and costly. Although deposition methods for fabricating micro electrodes using a reusable polymer mask have been proposed previously, these cannot address limitations of aspect ratio and shape accuracy of the micro electrodes owing to the process characteristics. This study aims to overcome these limitations by changing the mask structure and improving ion diffusion. The concentration of deposition electrolyte and other basic experimental conditions were the same as used in previous experiments. Various experiments were conducted by changing current density, electrolyte vibration, and electrolyte temperature, which significantly affect ion diffusion during the fabrication process. To verify the feasibility of the proposed process, high aspect ratio electrodes through electrode movement and multiple electrode shapes with a diameter of 200 μm were manufactured.

Keywords:

Electrochemical deposition, Multistage structured mask, Micro deposition, Ion diffusion, Micro electrode

Acknowledgments

이 연구는 서울과학기술대학교 교내연구비의 지원으로 수행되었습니다.

References

  • McGeough, J. A., Leu, M. C., Rajurkar, K. P., De Silva, A. K. M., Liu, Q., 2001, Electroforming Process and Application to Micro/Macro Manufacturing, CIRP Ann. Manuf. Technol., 50:2 499-514. [https://doi.org/10.1016/S0007-8506(07)62990-4]
  • Maleka, C. K., Saile, V., 2004, Applications of LIGA Technology to Precision Manufacturing of High-Aspect-Ratio Micro-Components and Systems: A Review, Microelectron. J. 35:2 131-143. [https://doi.org/10.1016/j.mejo.2003.10.003]
  • Cohen, A. L., Frodis, U., Tseng, F. G., Zhang, G., Mansfeld, F., Will, P. M., 1999, EFAB: Low-Cost, Automated Electrochemical Batch Fabrication of Arbitrary 3D Microstructures, Proc. SPIE Int. Soc. Opt. Eng., 3874 236-247. [https://doi.org/10.1117/12.361227]
  • Said, R. A., 2003, Microfabrication by Localized Electrochemical Deposition: Experimental Investigation and Theoretical Modeling, Nanotechnology, 14 523-531.
  • Cao, D. M., Jiang, J., Yang, R., Meng, W. J., 2006, Fabrication of High-aspect-ratio Microscale Mold Inserts by Parallel μEDM, Microsyst. Technol. 12:9 839-845. [https://doi.org/10.1007/s00542-006-0131-1]
  • Takahata, K., Gianchandani, Y. B., 2002, Batch Mode Micro-electro-discharge Machining, J. Microelectromech. Syst., 11:2 102-110. [https://doi.org/10.1109/84.993444]
  • Zhu, D., Zeng, Y. B., 2008, Micro Electroforming of High-aspect-ratio Metallic Microstructures by using a Movable Mask, CIRP Ann. Manuf. Technol., 57:1 227-230. [https://doi.org/10.1016/j.cirp.2008.03.092]
  • Habib, M. A., Gan, S. W., Rahman, M., 2009, Fabrication of Complex Shape Electrodes by Localized Electrochemical Deposition, J. Mater. Process. Technol., 209:9 4453-4458. [https://doi.org/10.1016/j.jmatprotec.2008.10.041]
  • Shin, H. S., 2016, Improvement of Reproducibility in Selective Electrodeposition Using Laser Masking and DC Voltage, J. Korean Soc. Manuf. Technol. Eng., 25:1 36-41. [https://doi.org/10.7735/ksmte.2016.25.1.36]
  • Park, M. S., Chung, D. K., Lee, K. H., Chu, C. N., 2011, Micro Hole Machining by EDM Using Insulated Tool Combined with Ultrasonic Vibration of Dielectric Fluid, J. Korean Soc. Manuf. Technol. Eng., 20:2 180-186.