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한국생산제조학회 학술지 영문 홈페이지
[ Papers ]
Journal of the Korean Society of Manufacturing Technology Engineers - Vol. 30, No. 2, pp.127-133
ISSN: 2508-5107 (Online)
Print publication date 15 Apr 2021
Received 23 Feb 2021 Revised 24 Mar 2021 Accepted 25 Mar 2021
DOI: https://doi.org/10.7735/ksmte.2021.30.2.127

의료전자기기 적용을 위한 Epoxy 솔더 접합부의 신뢰성 평가

전유재a ; 강민수b, *
Reliability Evaluation of Epoxy Solder Joints for Medical Electronic Devices
Yu-Jae Jeona ; Min-Soo Kangb, *
aDepartment of medical rehabilitation science, Yeoju Institute of Technology
bDivision of Smart Automotive Engineering, Sunmoon University

Correspondence to: *Tel.: +82-41-530-8359 E-mail address: kang10101@sunmoon.ac.kr (Min-Soo Kang). Contributed by footnote: 교신저자 문구

Abstract

In this study, the bonding characteristics of epoxy solder joints for the manufacture of highly reliable medical electronic devices were investigated. A total of 2000 cycles of thermal shock tests were performed by simulating the heat generation of electronic devices on specimens manufactured using eutectic solders (SAC305 and Sn58Bi) and epoxy solders (SACE and Sn58BiE). After the thermal shock, the formation of internal cracking owing to the difference in the thermal expansion coefficients of dissimilar material solder joints and the deterioration of the bonding properties of the solder joints was analyzed. Consequently, in the case of the epoxy solder, the epoxy was cured outside the solder joint, suppressing thermal stress owing to a difference in thermal expansion coefficients and suppressing the internal cracking of the solder joint, thereby improving the bonding characteristics of the solder joint.

Keywords:

Medical electronic device, Solder, Epoxy solder, Thermal shock test, Shear test, Metallography

References

  • Venkatadri, V., Yin, L., Xing, Y., Cotts, E., Srihari, K., Borgesen, P., 2009, Accelerating the Effects of Aging on the Reliability of Lead Free Solder Joints in a Quantitative Fashion, 59th Electronic Components and Technology Conference, 398-405. [https://doi.org/10.1109/ECTC.2009.5074045]
  • Kim, H. D., Yoon, D. Y., 2007, A Study on Thermal Stress Analysis of Plastic-Core Solder Balls, J. Korean Soc. Manuf. Technol. Eng., 16:6 159-162.
  • Kang, M. S., Kim, D. S., Shin, Y. E., 2019, Evaluation of Bonding Properties of Epoxy Solder Joints by High Temperature Aging Test, J. Korean Inst. Electr. Electron. Mater. Eng., 32:1 6-12. [https://doi.org/10.3390/ma12060960]
  • Jung, S. W., Kang, M. S., Jeon, Y. J., Kim, D. S., Shin, Y. E., 2016, A Study on the Degradation Characteristics of MLCCs SAC305 Lead-free Solder Joints and Growth IMCs by Thermal Shock Test, J. Korean Inst. Electr. Electron. Mater. Eng., 29:3 152-158. [https://doi.org/10.4313/JKEM.2016.29.3.152]
  • Jeon, Y. J., Son, S. I., Kim, D. S., Shin, Y. E., 2010, A Study of Thermal Shock Characteristics on the Joints of Automotive Application Component using Sn-3Ag-0.5 Cu Solder, J. Korean Inst. Electr. Electron. Mater. Eng., 23:8 611-616. [https://doi.org/10.4313/JKEM.2010.23.8.611]
  • Yim, B. S., Lee, B. H., Kim, J., Kim, J. M., 2014, Effect of Dispersion Condition of Multi-walled Carbon Nanotube (MWNT) on Bonding Properties of Solderable Isotropic Conductive Adhesives (ICAs), J. Mater. Sci.: Mater. Electron., 25 5208-5217. [https://doi.org/10.1007/s10854-014-2290-7]
  • Yim, B. S., Jeong, J. S., Lee, J. I., Oh, S. H., Kim, J. M., 2011, Electrical and Mechanical Properties of CNT-filled Solderable Electrically Conductive Adhesive, Journal of the Semiconductor & Display Technology, 10:4 37-42.
  • Ko, Y. H., Yu, D. Y., Son, J., Bang, J., Kim, T. S., 2019, Improving Joint Reliability of Lead-free Solder on Flexible Substrate under Cyclic Bending by Adding Graphene Oxide Powder, J. Microelectron. Packag. Soc., 26:3 43-49. [https://doi.org/10.6117/kmeps.2019.26.3.043]
  • Son, K., Kim, G., Ko, Y. H., Park, Y. B., 2019, Effects of Graphene Oxide Addition on the Electromigration Characteristics of Sn-3.0 Ag-0.5 Cu Pb-free Solder Joints, J. Microelectron. Packag. Soc., 26:3 81-88. [https://doi.org/10.6117/kmeps.2019. 26.3.081]
  • Kim, D. G., Kim, J. W., Jung, S. B., 2006, Evaluation of Solder Joint Reliability in Flip Chip Package under Thermal Shock Test, Thin solid films, 504:1-2 426-430. [https://doi.org/10.1016/j.tsf.2005.09.097]
  • Li, J., Karppinen, J., Laurila, T., Kivilahti, J. K., 2009, Reliability of Lead-free Solder Interconnections in Thermal and Power Cycling Tests, IEEE Trans. Compon. Packaging Technol., 32:2 302-308. [https://doi.org/10.1109/TCAPT.2009.2012518]
  • Tian, R., Hang, C., Tian, Y., Feng, J., 2019, Brittle Fracture Induced by Phase Transformation of Ni-Cu-Sn iIntermetallic Compounds in Sn-3Ag-0.5 Cu/Ni Solder Joints under Extreme Temperature Environment, J. Alloy. Compd., 777 463-471. [https://doi.org/10.1016/j.jallcom.2018.10.394]
  • Fu, S. W., Yu, C. Y., Lee, T. K., Liu, K. C., Duh, J. G., 2012, Impact Crack Propagation through the Dual-phased (Cu, Ni) 6Sn5 Layer in Sn-Ag-Cu/Ni Solder Joints, Mater. Lett., 80 103-105. [https://doi.org/10.1016/j.matlet.2012.04.099]
  • Kang, M. S., Jeon, Y. J., Kim, D. S., Shin, Y. E., 2016, Degradation Characteristics and Ni 3 Sn 4 IMC Growth by a Thermal Shock Test in SAC305 Solder Joints of MLCCs Applied in Automotive Electronics, Int. J. Precis. Eng. Manuf., 17:4 445-452. [https://doi.org/10.1007/s12541-016-0055-3]
  • Gu, J., Lin, J., Lei, Y., Fu, H., 2018, Experimental Analysis of Sn-3.0 Ag-0.5 Cu Solder Joint Board-level Drop/Vibration Impact Failure Models after Thermal/Isothermal Cycling, Microelectron. Reliab., 80 29-36. [https://doi.org/10.1016/j.microrel.2017.10.014]
  • Kang, M. S., Kim, D. S., Shin, Y. E., 2019, The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints, Materials, 12:6 960. [https://doi.org/10.3390/ma12060960]
  • Sharma, A., Jang, Y. J., Kim, J. B., Jung, J. P., 2017, Thermal Cycling, Shear and Insulating Characteristics of Epoxy Embedded Sn-3.0 Ag-0.5 Cu (SAC305) Solder Paste for Automotive Applications, J. Alloy. Compd., 704 795-803. [https://doi.org/10.1016/j.jallcom.2017.02.036]
  • Sharma, A., Cheon, J. S., Jung, J. P., 2019, Epoxy Polymer Solder Pastes for Micro-electronic Packaging Applications, J. Weld. Join., 37:2 7-14. [https://doi.org/10.5781/JWJ.2019.37.2.2]
  • Hu, X., Xu, T., Keer, L. M., Li, Y., Jiang, X., 2016, Microstructure Evolution and Shear Fracture Behavior of Aged Sn3Ag0. 5Cu/Cu Solder Joints, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 673 167-177. [https://doi.org/10.1016/j.msea.2016.07.071]
  • Sujan, G. K., Haseeb, A. S. M. A., Nishikawa, H., Amalina, M. A., 2017, Interfacial Reaction, Ball Shear Strength and Fracture Surface Analysis of Lead-free Solder Joints Prepared using Cobalt Nanoparticle Doped Flux, J. Alloy. Compd., 695 981-990. [https://doi.org/10.1016/j.jallcom.2016.10.219]
  • Jeon, Y. J., Kim, D. S., Shin, Y. E., 2011, A Study on the Fracture Mode Characteristics of Automotive Application Component Lead-free Solder Joints, Trans. Korean Soc. Automot. Eng., 19:6 90-96.
  • Sung, Y. G., Myung, W. R., Jeong, H., Ko, M. K., Moon, J., Jung, S. B., 2018, Mechanical Reliability of the Epoxy Sn-58wt.% Bi Solder Joints with Different Surface Finishes Under Thermal Shock, J. Electron. Mater., 47:7 4165-4169. [https://doi.org/10.1007/s11664-018-6224-7]
  • Myung, W. R., Kim, Y., Kim, K. Y., Jung, S. B., 2016, Drop Reliability of Epoxy-contained Sn-58 wt.% Bi Solder Joint with ENIG and ENEPIG Surface Finish under Temperature and Humidity Test, J. Electron. Mater., 45:7 3651-3658. [https://doi.org/10.1007/s11664-016-4517-2]
Yu-Jae Jeon

Professor in the Department of Medical Rehabitation Science, Yeoju Institute of Technology.His research interests are System control/Design/Manufacturing.

E-mail: superlittle@yit.ac.kr

Min-Soo Kang

Professor in Division of Smart Automotive Engineering, Sunmoon University.His research interests are Design/Manufacturing.

E-mail: kang10101@sunmoon.ac.kr