[ Article ]

Journal of the Korean Society of Manufacturing Technology Engineers - Vol. 27, No. 1, pp.27-34

ISSN: 2508-5107 (Online)

Print publication date 15 Feb 2018

Received 12 Oct 2017 Revised 22 Nov 2017 Accepted 04 Dec 2017

DOI: https://doi.org/10.7735/ksmte.2018.27.1.27

병렬 노즐 분사의 ITO 표면 포토레지스트 박리 조건에 관한 해석

김준현^a ; 고형호^a ; 이기성^b ; 주기태^b ; 김용성^b^{, *}

Investigation for Photoresist Stripping Conditions on the ITO Surface by the Multi-Spray Method

Joon Hyun Kim^a ; Hyoung Ho Ko^a ; Ki-Seong Lee^b ; Gi-Tae Joo^b ; Young Sung Kim^b^{, *}

aMechanical and Automotive Engineering, Seoul National University of Science & Technology, 232, Gongneung-ro, Nowon-gu, Seoul 01811, Korea
bGraduate School of NID Fusing Technology, Seoul National University of Science & Technology, 232, Gongneung-ro, Nowon-gu, Seoul 01811, Korea

Correspondence to: ^*Tel.: +82-2-970-6804, Fax: +82-2-970-6011, E-mail address: youngsk@seoultech.ac.kr (Young Sung Kim).

Abstract

Chemical stripping mechanisms are important because they are fundamentally involved in the rate of reaction of bonding and decomposition of materials. The stripping mechanism of a spray technology penetrates or removes a photoresist (PR) material on the indium tin oxide surface. It is the impact force produced by the velocity and mass of the stripper reaching the surface. The mechanisms in which a PR material is agitated or removed by proper liquid movement are dependent on material properties (e.g., viscosity) and conditions (e.g., temperature). Simple tests and numerical analysis have been conducted to determine the performance of a spray on PR materials exposed to a solution-type special stripper. The results performed to compare the impact force as varied by nozzle shape, spray distance, velocity, and flow rate to determine the relationship of the impact force to the performance in material removal.

Keywords:

Aqueous stripper, ITO-Glass, Nozzle, Photoresist, Spray, Stripping process

Acknowledgments

이 연구는 2016년 청정생산기반전문기술개발사업 과제번호10052250의 연구비 지원으로 수행되었습니다.

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