한국생산제조학회 학술지 영문 홈페이지
[ Papers ]
Journal of the Korean Society of Manufacturing Technology Engineers - Vol. 28, No. 4, pp.218-223
ISSN: 2508-5107 (Online)
Print publication date 15 Aug 2019
Received 07 Jul 2019 Accepted 09 Aug 2019
DOI: https://doi.org/10.7735/ksmte.2019.28.4.218

30 W급 COB LED의 열전소자 이용 강제방열

한재호a ; 임광희b ; 조영태c, *
Forced Heat Dissipation of 30 W COB LED with Use of Thermoelectric Modules
Jae-Ho Hana ; Kwang-Hee Imb ; Young-Tae Choc, *
aDepartment of Mechanical & Automotive Eng., Songwon University, 73, Songam-ro, Nam-gu, Gwangju 503742, Korea
bDepartment of Automotive Eng., Woosuk University, 443, Samrae-ro, Samrae-up, Wanju, Jeonbuk-do, 55338, Korea
cDepartment of Basic Science, School of Eng., Jeonju University, 303, Cheonjam-ro, Wansan-gu, Jeonju, Jeonbuk-do, 55069, Korea

Correspondence to: *Tel.: +82-63-220-2981 Fax: +82-63-220-2056 E-mail address: choyt@jj.ac.kr (Young-Tae Cho).

Abstract

This study focuses on the development and production of 120 W LED street-lamps using four 30 W chip on board (COB) LED modules. The lamps’ heat dissipation efficiency was improved by packaging 30 W COB LEDs and thermoelectric modules. This study was also conducted to reduce the thermoelectric element driving power consumption and minimize the thermoelectric element driving power, resulting from forced heat dissipation.

Results indicated that the minimum metal temperature of the metal core printed circuit board (MCPCB) reached 68.1℃ when the thermoelectric power consumption was 0.7 W; a temperature drop effect of approximately 16.1% occurred. The life extension effect is expected to be approximately 48.5% according to the lifespan arithmetic.

Thus, this technology can be applied to reduce the temperature and extend the life of COB LED modules; small-sized and lightweight luminaries can be realized by addressing the thermal problem of LED modules.

Keywords:

COB LED module, Multi-chip, Forced heat dissipation, Thermoelectric module (TEM), Heat sink

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