레이저 보조가공을 이용한 Si 광학부품의 초정밀 가공에 관한 연구
Abstract
The performance of optical components is sensitive to the surface roughness; hence, ultra-precision machining technique is significantly important. In this paper, ultra-precision machining and laser-assisted machining was performed; We evaluated them as methods for machining of silicon, an infrared optical component material. Machining brittle material by a diamond turning machine is challenging; laser-assisted machining resolves this issue. For instance, Si is an optical material with superior optical characteristics; however, Si usage is limited due to poor machinability. In contrast, Si can be machined with good surface roughness using laser-assisted machining. We obtained a surface roughness under Ra 10 nm, form accuracy under Pt 250 nm at the found optimal machining condition.
Keywords:
Ultra-precision machining, Laser-assisted machining, Surface roughness, Diamond turning, Infrared opticsReferences
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Ph.D. candidate in the Department of Mechanical Engineering, Chungnam National University. His research interest is PDM, CAD/CAM, and Injection Mold
E-Mail: scv3323@naver.com
Professor in the School of Mechanical Engineering, Chungnam National University. His research interest is Intelligent Measurement.
E-mail: hongjh@cnu.ac.kr