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Journal of the Korean Society of Manufacturing Technology Engineers - Vol. 33 , No. 2

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Journal of the Korean Society of Manufacturing Technology Engineers - Vol. 30, No. 2, pp. 127-133
Abbreviation: J. Korean Soc. Manuf. Technol. Eng.
ISSN: 2508-5107 (Online)
Print publication date 15 Apr 2021
Received 23 Feb 2021 Revised 24 Mar 2021 Accepted 25 Mar 2021
DOI: https://doi.org/10.7735/ksmte.2021.30.2.127
의료전자기기 적용을 위한 Epoxy 솔더 접합부의 신뢰성 평가
전유재^a ; 강민수^b^{, *}


Reliability Evaluation of Epoxy Solder Joints for Medical Electronic Devices
Yu-Jae Jeon^a ; Min-Soo Kang^b^{, *}
aDepartment of medical rehabilitation science, Yeoju Institute of Technology
bDivision of Smart Automotive Engineering, Sunmoon University
Correspondence to : ^*Tel.: +82-41-530-8359 E-mail address: kang10101@sunmoon.ac.kr (Min-Soo Kang). Contributed by footnote: 교신저자 문구

Abstract

In this study, the bonding characteristics of epoxy solder joints for the manufacture of highly reliable medical electronic devices were investigated. A total of 2000 cycles of thermal shock tests were performed by simulating the heat generation of electronic devices on specimens manufactured using eutectic solders (SAC305 and Sn58Bi) and epoxy solders (SACE and Sn58BiE). After the thermal shock, the formation of internal cracking owing to the difference in the thermal expansion coefficients of dissimilar material solder joints and the deterioration of the bonding properties of the solder joints was analyzed. Consequently, in the case of the epoxy solder, the epoxy was cured outside the solder joint, suppressing thermal stress owing to a difference in thermal expansion coefficients and suppressing the internal cracking of the solder joint, thereby improving the bonding characteristics of the solder joint.


Keywords: Medical electronic device, Solder, Epoxy solder, Thermal shock test, Shear test, Metallography

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Yu-Jae Jeon

Professor in the Department of Medical Rehabitation Science, Yeoju Institute of Technology.His research interests are System control/Design/Manufacturing.

E-mail: superlittle@yit.ac.kr

Min-Soo Kang

Professor in Division of Smart Automotive Engineering, Sunmoon University.His research interests are Design/Manufacturing.

E-mail: kang10101@sunmoon.ac.kr