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Journal of the Korean Society of Manufacturing Technology Engineers - Vol. 27 , No. 1

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[ Article ]
Journal of the Korean Society of Manufacturing Technology Engineers - Vol. 27, No. 1, pp. 20-26
Abbreviation: J. Korean Soc. Manuf. Technol. Eng.
ISSN: 2508-5107 (Online)
Print publication date 15 Feb 2018
Received 20 Dec 2017 Revised 12 Jan 2018 Accepted 15 Jan 2018
DOI: https://doi.org/10.7735/ksmte.2018.27.1.20
레이저 가속 플라이어 충돌에 의한 금속 표면상의 마이크로 딤플 어레이 가공 및 특성 파악
이정환^a ; 최대철^b ; 김홍석^a^{, *}


Patterning and Characterization of Micro-dimple Arrays on Metallic Surfaces by Laser-accelerated Flyer Impact
Jeong Hwan Lee^a ; Dae Cheol Choi^b ; Hong Seok Kim^a^{, *}
aDepartment of Mechanical and Automotive Engineering, Seoul National University of Science and Technology, 232, Gongneung-ro, Nowon-gu, Seoul 01811, Korea
bGraduate School, Department of Mechanical Engineering, Seoul National University of Science and Technology, 232, Gongneung-ro, Nowon-gu, Seoul 01811, Korea
Correspondence to : ^Tel.: +82-2-970-6333, Fax: +82-2-949-1458, E-mail address:*hongseok@seoultech.ac.kr (Hong Seok Kim).



Funding Information ▼ Seoul National University of Science and Technology

Abstract

In this paper, we have studied an efficient fabrication method that can produce a microscale dimple array at one instance by striking the workpiece with a thin metallic flyer accelerated by laser-induced plasma. Because the workpiece was embossed with the high-speed impact of the flyer, the benefits of high-speed processing, such as improved formability, could be realized. The effects of the laser-beam size, relative ratio of the laser-beam size to the flyer diameter, and flyer thickness on the forming performance were examined. It was found that, when the laser-beam size was smaller than the mold shape, the manufacturing performance was significantly lowered. To ensure the uniformity of the embossing dimples, it was more effective to increase the flyer speed by reducing the flyer thickness, rather than the diameter. Future research is needed to determine the optimal process conditions to improve the homogeneity of the dimple array.


Keywords: Laser accelerated flyer, Plasma, Micro dimple array, Embossing, Surface patterning

Acknowledgments

이 연구는 서울과학기술대학교 교내 학술연구비 지원으로 수행 되었습니다.

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