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[ Papers ] | |
Journal of the Korean Society of Manufacturing Technology Engineers - Vol. 29, No. 2, pp. 107-111 | |
Abbreviation: J. Korean Soc. Manuf. Technol. Eng. | |
ISSN: 2508-5107 (Online) | |
Print publication date 15 Apr 2020 | |
Received 25 Feb 2020 Revised 23 Mar 2020 Accepted 10 Apr 2020 | |
DOI: https://doi.org/10.7735/ksmte.2020.29.2.107 | |
3D-FOWLP에서 TMV (Through Mold Via) 유형(Cu-Via, EMC Filling Via)에 따른 열기계적 특성 시뮬레이션 분석 | |
Simulation Analysis of Thermal-mechanical Characteristics According to Type of Through Mold Via Technology in 3D Fan-out Wafer Level Packaging | |
Ji-Hoon Chaa ; Kyu Songb ; Man-Jin Parkb ; Sang-Yong Parkc ; Jae-Cheon Leec ; Sung-Hyuk Leec ; Dong-Young Janga, b, *
| |
aDept. of Manufacturing Systems and Design Engineering, Seoul National University of Science and Technology | |
bKorea Electronics-Machinery Convergence Technology Institute | |
cNepes Co., Ltd | |
Correspondence to : *Tel.: +82-2-970-6450 E-mail address: dyjang@seoultech.ac.kr (DongYoung Jang). | |
Funding Information ▼ |
Currently, Through mold via (TMV) technology is being actively researched for 3D-Intergrated Circuit stacking in fan-out wafer level packaging (FOWLP). However, because of problems, such as extrusion, cracking, and warping of the Cu materials forming the via, its mass production process is difficult. Moreover, sudden temperature changes when using the chips cause heat fatigue in the TMV. To overcome this problem, the Epoxy molding compound (EMC) filling via (EFV) is being developed to form a thin Cu via through a deposition process and then fill the interior of the via with EMC. Through simulations, this study analyzed the thermal-mechanical properties of the TMV in the 3D-FOWLP according to the type of TMV (Cu via and EFV) to minimize the thermal stress and deformation generated when using the chip. Consequently, EFV exhibits better thermal-mechanical properties in comparison with those of the Cu via when the 3D-FOWLP is deformed by heat.
Keywords: FOWLP, MCP, TMV (Through Mold Via), EFV (EMC Filling Via), Warpage simulation, Package stacking |
이 연구는 산업통산자원부 산업 기술혁신사업의 지원을 받아 수행된 연구 결과입니다[20000868, FO package를 이용한 인공지능 3D-IC 제조공정 기술].
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2. | Seol, H. S., Choi, Y. J., Park, J. M., Kim, S. K., 2019, Warpage Analysis of a Panel Level Packaging, J. Korean Soc. Manuf. Technol. Eng., 28:4 203-209. |
3. | Kan, K., Oi, Y., Fujii, Y., Miwa, M., 2016, The Novel Liquid Molding Compound for Fan-out Wafer Level Package, International Conference on Electronics Packaging (ICEP), IEEE, 557-561. |
4. | Lee, M. K., Jeoung, J. W., Ock, J. Y., Choa, S. H., 2014, Numerical Analysis of Warpage and Reliability of Fan-out Wafer Level Package, Journal of the Microelectronics & Packaging Society, 21:1 31-39. |
5. | Lee, H. S., Kim, K. H., Choa, S. H., 2012, Warpage and Stress Simulation of Bonding Process-Induced Deformation for 3D Package Using TSV Technology, Journal of the Korean Society for Precision Engineering, 29:5 563-571. |
6. | Ko, J. Y., 2018, viewed 25 August 2018, Samsung Mass-produces Automotive D-RAM that Can Withstand Temperatures of 125 Degrees, <www.hankyung.com/economy/article/2018042590081>. |
7. | Jeoung, H. S., 2014, Thermo-mechanical Reliability of TSV Structure for 3D Stacked Semiconductor Package, A master’s thesis on engineering, Seoul National University of Science And Technology, Republic of Korea. |
Master Course in the Department of Mechanical Systems and Design Engineering, Seoul National University of Science and Technology.His research interest is Thermal-Mechanical Simulation Analysis.
E-mail: wlwlw555555@gmail.com
Korea Electronics-Machinery Convergence Technology Institute. His/Her research interest is Machine.His research interest is Thermal-Mechanical Simulation Analysis.
E-mail: songkyu@kemcti.re.kr
Korea Electronics-Machinery Convergence Technology Institute.His research interest is Charged Particle Beam System.
E-mail: manjin@kemcti.re.kr
Engineering in R&D Division, Nepes in Korea.His research interest is SiP Packaging.
E-mail: psy0408@nepes.co.kr
Engineering in R&D Division, Nepes in Korea.His research interest is SiP Packaging.
E-mail: leejc@nepes.co.kr
Engineering in R&D Division, Nepes in Korea.His research interest is SiP Packaging.
E-mail: lsh0815@nepes.co.kr
Professor in the Department of Manufacturing Systems and Design Engineering, Seoul National University of Science and Technology.His research interest is Charged Particle Beam System.
E-mail: dyjang@seoultech.ac.kr