한국생산제조학회 학술지 영문 홈페이지
[ Article ]
Journal of the Korean Society of Manufacturing Technology Engineers - Vol. 33, No. 4, pp.172-177
ISSN: 2508-5107 (Online)
Print publication date 15 Aug 2024
Received 30 Jul 2024 Revised 12 Aug 2024 Accepted 14 Aug 2024
DOI: https://doi.org/10.7735/ksmte.2024.33.4.172

CVD Chamber 방사율 변화에 따른 Wafer 온도에 대한 수치해석적 연구

유승관a ; 김승모a, *
Numerical Analysis of Wafer Temperature with Respect to Radiation Variation in CVD Chamber
Seoung Kwan Youa ; Seung Mo Kima, *
aSchool of Mechanical Engineering, Korea University of Technology and Education

Correspondence to: *Tel.: +82-41-560-1159 E-mail address: smkim@koreatech.ac.kr (Seung Mo Kim).

Abstract

In this study, the temperature within a CVD chamber at 10 Torr was numerically investigated using Computational Fluid Dynamics (CFD). A detailed threedimensional (3D) representation of the chamber illustrates the deposition due to CVD on the showerhead and chamber walls. In this study, the changes in the average temperature and temperature variation of a wafer, when the surface emissivity changes due to this deposition, are examined. Additionally, the effects of varying the process gap, which is the distance between the wafer and showerhead, on the temperature distribution of the wafer are analyzed. Based on these analyses, in this study, specific process variables are proposed to optimize the average temperature and temperature uniformity of the wafer. Finally, methods to mitigate the impact of changes in emissivity and ensure consistent wafer quality are proposed.

Keywords:

Wafer temperature, CVD chamber, Radiation, Showerhead, Drift, CFD

Acknowledgments

본 연구는 산업통상자원부와 한국산업기술기획평가원의 지원(20021828)과 2024년도 한국기술교육대학교 교육연구진흥과제의 연구비 지원 및 한국연구재단의 지자체-대학 협력기반 지역혁신 사업(2021RIS-004)으로 연구되었음.

References

  • Li, Q., Zhang, Y., Ji, B., Zhang, S., Tu, R., 2023, Improvement of SiC Deposition Uniformity in CVD Reactor by Showerhead with Baffle, J. Cryst. Growth, 615 127255. [https://doi.org/10.1016/j.jcrysgro.2023.127255]
  • Tan, S. A., Yu, K. H., Abdullah, M. Z., 2022, Heat Transfer Analysis on Wafer Annealing Process in Semiconductor Multi-wafer Furnace using CFD Simulation, J. Mech. Sci. Technol., 36 3143-3151. [https://doi.org/10.1007/s12206-022-0545-4]
  • Kleijn, C. R., van der Meer, Th. H., Hoogendoorn, C. J., 1989, A Mathematical Model for LPCVD in a Single Wafer Reactor, J. Electrochem. Soc., 136 3423. [https://doi.org/10.1149/1.2096465]
  • Al Bosta, M. M. S., Ma, K. -J., Chien, H. -H., 2013, The Effect of MAO Processing time on Surface Properties and Low Temperature Infrared Emissivity of Ceramic Coating on Aluminium 6061 Alloy, Infrared Phys. Technol., 60 323-334. [https://doi.org/10.1016/j.infrared.2013.06.006]
  • Jung, W.-C., Jin, Y.-H., Choi, J.-J., Yang, J.-K., 2018, A Study on the Wear Resistance Characteristics of Anodic Oxide Films Formed on Aluminium alloy using a Plasma Electrolytic Oxidation, Journal of the Korean Institute of Surface Engineering, 51:6 381-386. [https://doi.org/10.5695/JKISE.2018.51.6.381]
Seoung Kwan You

Ph.D. Candidate in the Department of Mechanical Engineering, Korea University of Technology and Education. His research interest is Semiconductor and Fluid Dynamics.

E-mail: soongan@koreatech.ac.kr

Seung Mo Kim

Professor in the Department of Mechanical Engineering in Korea University of Technology and Education. His research interests are Computational Fluid Dynamics in Semiconductor Equipment.

E-mail: smkim@koreatech.ac.kr