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Journal of the Korean Society of Manufacturing Technology Engineers - Vol. 28 , No. 4

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Journal of the Korean Society of Manufacturing Technology Engineers - Vol. 28, No. 4, pp. 218-223
Abbreviation: J. Korean Soc. Manuf. Technol. Eng.
ISSN: 2508-5107 (Online)
Print publication date 15 Aug 2019
Received 07 Jul 2019 Accepted 09 Aug 2019
DOI: https://doi.org/10.7735/ksmte.2019.28.4.218
30 W급 COB LED의 열전소자 이용 강제방열
한재호^a ; 임광희^b ; 조영태^c^{, *}



Forced Heat Dissipation of 30 W COB LED with Use of Thermoelectric Modules
Jae-Ho Han^a ; Kwang-Hee Im^b ; Young-Tae Cho^c^{, *}
aDepartment of Mechanical & Automotive Eng., Songwon University, 73, Songam-ro, Nam-gu, Gwangju 503742, Korea
bDepartment of Automotive Eng., Woosuk University, 443, Samrae-ro, Samrae-up, Wanju, Jeonbuk-do, 55338, Korea
cDepartment of Basic Science, School of Eng., Jeonju University, 303, Cheonjam-ro, Wansan-gu, Jeonju, Jeonbuk-do, 55069, Korea
Correspondence to : ^*Tel.: +82-63-220-2981 Fax: +82-63-220-2056 E-mail address: choyt@jj.ac.kr (Young-Tae Cho).

Abstract

This study focuses on the development and production of 120 W LED street-lamps using four 30 W chip on board (COB) LED modules. The lamps’ heat dissipation efficiency was improved by packaging 30 W COB LEDs and thermoelectric modules. This study was also conducted to reduce the thermoelectric element driving power consumption and minimize the thermoelectric element driving power, resulting from forced heat dissipation.

Results indicated that the minimum metal temperature of the metal core printed circuit board (MCPCB) reached 68.1℃ when the thermoelectric power consumption was 0.7 W; a temperature drop effect of approximately 16.1% occurred. The life extension effect is expected to be approximately 48.5% according to the lifespan arithmetic.

Thus, this technology can be applied to reduce the temperature and extend the life of COB LED modules; small-sized and lightweight luminaries can be realized by addressing the thermal problem of LED modules.


Keywords: COB LED module, Multi-chip, Forced heat dissipation, Thermoelectric module (TEM), Heat sink

References


1.	Cho, Y. T., Ma, S. D., 2011, Heat Dissipation of High-power Multichip LED Lighting, 2011 KSMTE Autumn Conference, 120.
2.	Jeong, B. M., Jeong, H. G., 2006, LED Lighting Technology Status and Prospects, The Korean Institute of Illuminating and Electrical Installation Engineers, 20:1 31-37.
3.	Sterling, B., 2003, Ten Technologies that Deserve to Die, Technology Review: MIT's Magazine of Innovation, 106:8 52-56.
4.	Jung, T. S., Kang, H. K., 2012, Evaluation on the Cooling Performance to Design Heat sinks for LED lightings, Journal of the Korean Society for Precision Engineering, 29:7 778-784.
5.	Han, J. M., Seo, I. J., Ahn, Y., Ko, Y. S., Kim, T. H., 2014, Thermo-compression Process for High Power LEDs, J. of the KSMTE, 23:4 355-360.
6.	The Energytimes, viewed 5 December 2011, <http://www.energytimes.kr/news/articleView.html>.
7.	Hu, J., Yang, L., Shin, M. W., 2008, Electrical, Optical, and Thermal Degradation of High Power GaN/InGaN Light-Emitting Diodes, Journal of Physics D: Applied Physics, 41:3 035107-035111.
8.	Narendran, N., Gu, Y., 2005, Life of LED-based White Light Sources, Journal of Display Technology, 1:1 167-170.
9.	Cho, Y. T., 2012, Heat Radiation of Multichip 10W LED Light Using Thermoelectric Module(TEM), J. of the KSMTE, 21:1 46-50.