Journal Archive

Journal of the Korean Society of Manufacturing Technology Engineers - Vol. 31 , No. 3

[Paper List] [Go to Volume List]


[ Best Paper of This Month ]
Journal of the Korean Society of Manufacturing Technology Engineers - Vol. 31, No. 3, pp. 147-153
Abbreviation: J. Korean Soc. Manuf. Technol. Eng.
ISSN: 2508-5107 (Online)
Print publication date 15 Jun 2022
Received 06 May 2022 Revised 31 May 2022 Accepted 02 Jun 2022
DOI: https://doi.org/10.7735/ksmte.2022.31.3.147
Finite Element Analysis and Fabrication of a 3 MHz Megasonic System for Semiconductor Cleaning
Hyunse Kim^a^{, b}^{, *} ; Euisu Lim^a ; Yanglae Lee^a
aInnovative Energy Machinery Research Division, Korea Institute of Machinery and Materials
bDepartment of Mechanical Engineering, University of Science & Technology


Correspondence to : ^*Tel.: +82-2-868-7967 E-mail address: hkim@kimm.re.kr (Hyunse Kim).



Funding Information ▼ Korea Evaluation Institute of Industrial Technology Ministry of Knowledge Economy NK237C Korea Institute of Machinery and Materials

Abstract

Megasonic cleaning has been used to clean contaminants from wafer surfaces in semiconductor production. This research developed a 3 MHz megasonic waveguide for cleaning processes in semiconductor industries. Firstly, a 1 MHz type was fabricated in aluminum (Al) and quartz, consisting of a lead zirconate titanate (PZT) actuator and a waveguide. A 3 MHz quartz waveguide was also fabricated based on the fabricated results, and its performance was tested. In the design process, finite element analysis was performed. As a result, the predicted value was 2.997 MHz, which agreed with the measured value of 2.995 MHz with a 0.1% error. Lastly, a particle removal efficiency (PRE) test was performed, and the results showed that 93.1% PRE was achieved at 8W power. Considering the acoustic pressure and the cleaning test results, the 3 MHz megasonic may help the removal of contaminants from wafer surfaces effectively.


Keywords: Megasonic, Cleaning, Finite element method(FEM), Waveguide, Piezoelectric actuator

Acknowledgments

This research was supported by the Korea Evaluation Institute of Industrial Technology (KEIT), under the Korea government Ministry of Knowledge Economy and by a research project (NK237C) of the Korea Institute of Machinery and Materials (KIMM).

References


1.	Kanegsberg, B., Kanegsberg, E., 2000, Handbook for Critical Cleaning, CRC Press, Boca Raton, U.S.A..
2.	Liu, Y., Geng, D., Shao, Z., Zhou, Z., Jiang, X., Zhang, D., 2021, A Study on Strengthening and Machining Integrated Ultrasonic Peening Drilling of Ti-6Al-4V, Materials & Design, 212 110238.
3.	Kim, H., Lim, E., Lee, Y., Park, J.-K., 2019, Fabrication and Performance Tests of an Ultrasonic Cleaning System for Solar-cell Wafers, J. Korean Soc. Manuf. Technol. Eng., 28:4 210-217.
4.	Kim, H., Lim, E., Park, J.-K., 2017, Development of a 20 kHz Ultrasonic System for Nano-surface Reformation Process, J. Korean Soc. Manuf. Technol. Eng., 26:4 365-370.
5.	Su, H., Shen, X., Xu, C., He, J., Wang, B., Su, G., 2020, Surface Characteristics and Corrosion Behavior of TC11 Titanium Alloy Strengthened by Ultrasonic Roller Burnishing at Room and Medium Temperature, J. Mater. Res. Technol., 9:4 8172-8185.
6.	Yang, X., Yang, X., Gu, H., Kawai, K., Arima, K., Yamamura, K., 2022, Efficient and Slurryless Ultrasonic Vibration Assisted Electrochemical Mechanical Polishing for 4H–SiC Wafers, Ceram. Int., 48:6 7570-7583.
7.	Li, H., Chen, T., Duan, Z., Zhang, Y., Li, H., 2022, A Grinding Force Model in Two-dimensional Ultrasonic-assisted Grinding of Silicon Carbide, J. Mater. Process Technol., 304 117568.
8.	Ni, Z. L., Liu, Y., Wang, Y. H., He, B. Y., 2022, Interfacial Bonding Mechanism and Fracture Behavior in Ultrasonic Spot Welding of Copper Sheets, Materials Science and Engineering: A, 833 142536.
9.	Kim, H., Lee, Y., Lim, E., 2009, Design and Fabrication of an L-type Waveguide Megasonic System for Cleaning of Nano-scale Patterns, Curr. Appl. Phys., 9:2 e189-e192.
*10.*	Kim, H., Lee, Y., Lim, E., 2013, Design and Fabrication of a Horn-type Megasonic Waveguide for Nanoparticle Cleaning, IEEE Trans. on Semiconductor Manufacturing, 26:2 221-225.
*11.*	Keswani, M., Raghavan, S., Deymier, P., 2013, A Novel Way of Detecting Transient Cavitation Near a Solid Surface during Megasonic Cleaning using Electrochemical Impedance Spectroscopy, Microelectron. Eng., 108 11-15.
*12.*	Hauptmann, M., Brems, S., Camerotto, E., Zijlstra, A., Doumen, G., Bearda, T., Mertens, P.W., Lauriks, W., 2010, Influence of Gasification on the Performance of a 1 MHz Nozzle System in Megasonic Cleaning, Microelectron. Eng., 87:5-8 1512-1515.

Hyunse Kim

Principal researcher in the Innovative Energy Machinery Research Division, Korea Institute of Machinery and Materials, and a Professor in University of Science & Technology. His research interest is ultrasonic cleaning, megasonic cleaning and ultrasonic machining.

E-mail: hkim@kimm.re.kr

Euisu Lim

Principal technician in the Innovative Energy Machinery Research Division, Korea Institute of Machinery and Materials. His research interest is ultrasonic and megasonic cleaning.

E-mail: eslim@kimm.re.kr

Yanglae Lee

Principal researcher in the Innovative Energy Machinery Research Division, Korea Institute of Machinery and Materials. His research interest is ultrasonic and megasonic cleaning.

E-mail: yllee@kimm.re.kr